Scipediacontent: Scipediacontent moved page Draft Content 716890528 to Memik et al 2010a

2021-02-02T03:47:01Z

Scipediacontent moved page Draft Content 716890528 to Memik et al 2010a

Scipediacontent: Created page with " == Abstract == Variability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as va..."

2021-02-02T03:46:55Z

Created page with " == Abstract == Variability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as va..."

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== Abstract ==

Variability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as variations in performance, power consumption, and reduction in reliability in the manufactured chips as well as low yield levels. Their implications on performance and yield are particularly profound on 3D architectures: a defect on even a single layer can render the entire stack useless. In this paper, we show that instead of causing increased yield losses, we can actually exploit 3D technology to reduce yield losses by intelligently devising the architectures. We take advantage of the layer-to-layer variations to reduce yield losses by splitting critical components among multiple layers. Our results indicate that our proposed method achieves a 30.6% lower yield loss rate compared to the same pipeline implemented on a 2D architecture.

== Original document ==

The different versions of the original document can be found in:

* [http://www.ece.northwestern.edu/%7Eada829/pubs/ozdemir_dac2010.pdf http://www.ece.northwestern.edu/%7Eada829/pubs/ozdemir_dac2010.pdf]

* [http://www.ece.northwestern.edu/~choudhar/Publications/QuantifyingCopingParametricVariations.pdf http://www.ece.northwestern.edu/~choudhar/Publications/QuantifyingCopingParametricVariations.pdf],
: [https://dblp.uni-trier.de/db/conf/dac/dac2010.html#OzdemirPDMLC10 https://dblp.uni-trier.de/db/conf/dac/dac2010.html#OzdemirPDMLC10],
: [http://users.eecs.northwestern.edu/~ada829/pubs/ozdemir_dac2010.pdf http://users.eecs.northwestern.edu/~ada829/pubs/ozdemir_dac2010.pdf],
: [http://cucis.ece.northwestern.edu/publications/pdf/OzdYan10A.pdf http://cucis.ece.northwestern.edu/publications/pdf/OzdYan10A.pdf],
: [http://yadda.icm.edu.pl/yadda/element/bwmeta1.element.ieee-000005522719 http://yadda.icm.edu.pl/yadda/element/bwmeta1.element.ieee-000005522719],
: [https://www.scholars.northwestern.edu/en/publications/quantifying-and-coping-with-parametric-variations-in-3d-stacked-m https://www.scholars.northwestern.edu/en/publications/quantifying-and-coping-with-parametric-variations-in-3d-stacked-m],
: [https://dl.acm.org/citation.cfm?doid=1837274.1837312 https://dl.acm.org/citation.cfm?doid=1837274.1837312],
: [http://eecs.northwestern.edu/~memik/papers/dac10.pdf http://eecs.northwestern.edu/~memik/papers/dac10.pdf],
: [https://ieeexplore.ieee.org/document/5522719/citations https://ieeexplore.ieee.org/document/5522719/citations],
: [https://academic.microsoft.com/#/detail/2053822874 https://academic.microsoft.com/#/detail/2053822874]

* [http://dl.acm.org/ft_gateway.cfm?id=1837312&ftid=827211&dwn=1 http://dl.acm.org/ft_gateway.cfm?id=1837312&ftid=827211&dwn=1],
: [http://dx.doi.org/10.1145/1837274.1837312 http://dx.doi.org/10.1145/1837274.1837312]

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Scipediacontent: Scipediacontent moved page Draft Content 716890528 to Memik et al 2010a

Scipediacontent: Created page with " == Abstract == Variability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as va..."