Scipediacontent: Scipediacontent moved page Draft Content 830971991 to Guerriero et al 2016a

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Scipediacontent moved page Draft Content 830971991 to Guerriero et al 2016a

Scipediacontent: Created page with " == Abstract == International audience; Burn-In (BI) test is usually applied in manufacturing process to screen out chip early life failures, especially for safety critical a..."

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Created page with " == Abstract == International audience; Burn-In (BI) test is usually applied in manufacturing process to screen out chip early life failures, especially for safety critical a..."

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== Abstract ==

International audience; Burn-In (BI) test is usually applied in manufacturing process to screen out chip early life failures, especially for safety critical applications. Unfortunately, this test method has elevated costs for companies. In recent days, Faster-than-at-Speed-Test (FAST) has become a useful technique to discover small delay defects. At the same time, overclocking methods to enhance system performances have been studied, which focus on temperature management to preserve system functionalities. In this paper, a FAST technique is approached with the aim of intentionally provoking a thermal overheating in the microprocessor by mean of the execution of functional test programs, partly regardless of system behavior preservation. The goal is to introduce an internal stress stronger than current procedures used during BI in order to speed up early detection of latent faults. The method illustrates how to avoid blocking configurations due to timing constraints violation and leads to a significant increase of the switching activity. Experimental results on a MIPS architecture show that, by using the described technique, the processor is not falling into an unpredictable state even at frequencies up to about 20 times higher than the nominal one and the switching activity is increasing up to 300% per nanoseconds.

== Original document ==

The different versions of the original document can be found in:

* [https://hal-lirmm.ccsd.cnrs.fr/lirmm-01444403 https://hal-lirmm.ccsd.cnrs.fr/lirmm-01444403]

* [http://xplorestaging.ieee.org/ielx7/7744451/7753408/07753581.pdf?arnumber=7753581 http://xplorestaging.ieee.org/ielx7/7744451/7753408/07753581.pdf?arnumber=7753581],
: [http://dx.doi.org/10.1109/vlsi-soc.2016.7753581 http://dx.doi.org/10.1109/vlsi-soc.2016.7753581]

* [https://hal-lirmm.ccsd.cnrs.fr/lirmm-01444403 https://hal-lirmm.ccsd.cnrs.fr/lirmm-01444403],
: [https://iris.polito.it/handle/11583/2658888 https://iris.polito.it/handle/11583/2658888],
: [https://dblp.uni-trier.de/db/conf/vlsi/vlsisoc2016.html#BernardiBNGV16 https://dblp.uni-trier.de/db/conf/vlsi/vlsisoc2016.html#BernardiBNGV16],
: [https://academic.microsoft.com/#/detail/2550765718 https://academic.microsoft.com/#/detail/2550765718]

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Guerriero et al 2016a - Revision history

Scipediacontent: Scipediacontent moved page Draft Content 830971991 to Guerriero et al 2016a

Scipediacontent: Created page with " == Abstract == International audience; Burn-In (BI) test is usually applied in manufacturing process to screen out chip early life failures, especially for safety critical a..."